• Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials
  • Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials
  • Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials
  • Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials
  • Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials
  • Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials

Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials

Natural Abrasive Type: Natural Corundum
Artificial Abrasive Type: Corundum Abrasives
Application: Machinery
Function: Surface Deburring
Source: Artificial Abrasives
Particle Size: Abrasive
Samples:
US$ 150/kg 1 kg(Min.Order)
| Request Sample
Customization:
Manufacturer/Factory & Trading Company
Diamond Member Since 2023

Suppliers with verified business licenses

Henan, China
Experienced Team
The supplier has 7 foreign trading staff(s) and 3 staff(s) with over 6 years of overseas trading experience
Fast Delivery
The supplier can deliver the goods within 15 days
Raw-Materials Traceability
The supplier has traceability identification of raw materials
R&D Capabilities
The supplier has 1 R&D engineers, you can check the Audit Report for more information
to see all verified strength labels (9)

Basic Info.

Model NO.
0.3-5um
Hardness
Superabrasive
Purity
99.5%
Melt Point
2980
Mohs Hardness
8.5
Bulk Density
3.9-4.0 g/cm3
Transport Package
Bag Pallet and Jumbo
Specification
F6-F220
Trademark
XINLI
Origin
China
HS Code
2818200000
Production Capacity
30000

Product Description



 
Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials
Alumina Oxide is a highly pure form of aluminium oxide.This iron-free, reusable blasting medium is angular, brittle and hard. It has a powerful abrasive effect on the surface being blasted.

Alumina powder is different formula after high temperature calcination. Alumina powder is difficult dissolved in water white amorphous powder, odorless, tasteless, strong chemical stability, high purity, true than significant, good insulation performance and so on
 
Advantages:
1. Does not affect the color of processed parts;
2. It can be used for sandblasting in a process where iron powder residue is strictly prohibited;
3. Plastic grade white corundum particles are very suitable for wet sandblasting and polishing and grinding operations.
Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials


Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging MaterialsAl2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging MaterialsAl2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging MaterialsAl2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials
Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials
Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging MaterialsAl2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging MaterialsAl2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging MaterialsAl2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging MaterialsAl2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging MaterialsAl2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials
Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging MaterialsAl2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials
Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials
Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials

Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials
Al2O3 High Thermal Conductivity and Mechanical Strength for Aluminium Oxide for Semiconductor Chip Packaging Materials

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